Network-on-Chips for Future 3D Stacked Dies (Invited)

Tiago Mück. Network-on-Chips for Future 3D Stacked Dies (Invited). In ACM/IEEE International Workshop on System Level Interconnect Prediction, SLIP 2021, Munich, Germany, November 4, 2021. pages 59, IEEE, 2021. [doi]

Abstract

Abstract is missing.