Abstract is missing.
- Recent Advances and Future Challenges in 2.5D/3D Heterogeneous Integration (Invited)Tanay Karnik. [doi]
- A Novel System-Level Physics-Based Electromigration Modelling Framework: Application to the Power Delivery NetworkHouman Zahedmanesh, Ivan Ciofi, Odysseas Zografos, Mustafa Badaroglu, Kristof Croes. 1-7 [doi]
- Design and System Technology Co-Optimization Sensitivity Prediction for VLSI Technology Development using Machine LearningChung-Kuan Cheng, Chia-Tung Ho, Chester Holtz, Bill Lin. 8-15 [doi]
- Enabling Chiplet Integration Beyond 7nm (Invited)Suresh Ramalingam. 16 [doi]
- Design And Sign-off Methodologies For Wafer-To-Wafer Bonded 3D-ICs At Advanced Nodes (invited)Giuliano Sisto, Rongmei Chen, Richard Chou, Geert Van der Plas, Eric Beyne, Rod Metcalfe, Dragomir Milojevic. 17-23 [doi]
- Chip Stacking and Packaging Technology Explorations for Hardware Security (Invited)Makoto Nagata. 24 [doi]
- Performance-Aware Interconnect Delay Insertion Against EM Side-Channel AttacksMinmin Jiang, Vasilis F. Pavlidis. 25-32 [doi]
- Reconfigurable on-chip wireless interconnections through optical phased arrays (Invited)Giovanna Calò, Marina Barbiroli, Gaetano Bellanca, Davide Bertozzi, Franco Fuschini, Velio Tralli, Giovanni Serafino, Vincenzo Petruzzelli. 33-40 [doi]
- Silicon Photonics Technology for Terabit-scale Optical I/O (Invited)Joris Van Campenhout. 41 [doi]
- Designing a Multi-Chiplet Manycore System using the POPSTAR Optical NoC Architecture (Invited)Yvain Thonnart. 42 [doi]
- The Open Domain-Specific Architecture: An Introduction (Invited)Bapi Vinnakota. 43 [doi]
- SID-Mesh: Diagonal Mesh Topology for Silicon Interposer in 2.5D NoC with Introducing a New Routing AlgorithmBabak Sharifpour, Mohammad Sharifpour, Midia Reshadi. 44-51 [doi]
- RAMAN: Reinforcement Learning Inspired Algorithm for Mapping Applications onto Mesh Network-on-ChipJitesh Choudhary, Soumya J., Linga Reddy Cenkeramaddi. 52-58 [doi]
- Network-on-Chips for Future 3D Stacked Dies (Invited)Tiago Mück. 59 [doi]