Markus Müller, Tobias Nardmann, Maximilian Froitzheim, Michael Schröter. Characterization and Modeling of Thermal Coupling in Multi-Finger InP DHBTs. In 2022 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2022, Phoenix, AZ, USA, October 16-19, 2022. pages 208-211, IEEE, 2022. [doi]
@inproceedings{MullerNFS22,
title = {Characterization and Modeling of Thermal Coupling in Multi-Finger InP DHBTs},
author = {Markus Müller and Tobias Nardmann and Maximilian Froitzheim and Michael Schröter},
year = {2022},
doi = {10.1109/BCICTS53451.2022.10051728},
url = {https://doi.org/10.1109/BCICTS53451.2022.10051728},
researchr = {https://researchr.org/publication/MullerNFS22},
cites = {0},
citedby = {0},
pages = {208-211},
booktitle = {2022 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2022, Phoenix, AZ, USA, October 16-19, 2022},
publisher = {IEEE},
isbn = {978-1-6654-9132-7},
}