Markus Müller, Tobias Nardmann, Maximilian Froitzheim, Michael Schröter. Characterization and Modeling of Thermal Coupling in Multi-Finger InP DHBTs. In 2022 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2022, Phoenix, AZ, USA, October 16-19, 2022. pages 208-211, IEEE, 2022. [doi]
Abstract is missing.