Rakesh Murthy, Aditya N. Das, Dan O. Popa, Harry E. Stephanou. M3: Multiscale, Deterministic and Reconfigurable Macro-Micro Assembly System for Packaging of MEMS. In 2007 IEEE International Conference on Robotics and Automation, ICRA 2007, 10-14 April 2007, Roma, Italy. pages 668-673, IEEE, 2007. [doi]
Abstract is missing.