Mariappan Murugesan, Jichoel Bea, H. Hashimoto, K. W. Lee, Mitsu Koyanagi, Takafumi Fukushima, Tetsu Tanaka. Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study. In 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE, 2015. [doi]
Abstract is missing.