Effect of CVD Mn oxide layer as Cu diffusion barrier for TSV

Mariappan Murugesan, Jichoel Bea, Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi, Y. Sutou, H. Wang, J. Koike. Effect of CVD Mn oxide layer as Cu diffusion barrier for TSV. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-4, IEEE, 2013. [doi]

Abstract

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