Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications - researchr publication authors

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Mariappan Murugesan, E. Sone, A. Simomura, Makoto Motoyoshi, M. Sawa, K. Fukuda, Mitsumasa Koyanagi, Takafumi Fukushima. Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications. In IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021. pages 1-4, IEEE, 2021. [doi]

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