Mariappan Murugesan, E. Sone, A. Simomura, Makoto Motoyoshi, M. Sawa, K. Fukuda, Mitsumasa Koyanagi, Takafumi Fukushima. Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications. In IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021. pages 1-4, IEEE, 2021. [doi]
@inproceedings{MurugesanSSMSFK21,
title = {Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications},
author = {Mariappan Murugesan and E. Sone and A. Simomura and Makoto Motoyoshi and M. Sawa and K. Fukuda and Mitsumasa Koyanagi and Takafumi Fukushima},
year = {2021},
doi = {10.1109/3DIC52383.2021.9687604},
url = {https://doi.org/10.1109/3DIC52383.2021.9687604},
researchr = {https://researchr.org/publication/MurugesanSSMSFK21},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021},
publisher = {IEEE},
isbn = {978-1-6654-1706-8},
}