Mark Nakamoto, Riko Radojcic, Wei Zhao, Vinay K. Dasarapu, Aditya P. Karmarkar, Xiaopeng Xu. Simulation methodology and flow integration for 3D IC stress management. In Jacqueline Snyder, Rakesh Patel, Tom Andre, editors, IEEE Custom Integrated Circuits Conference, CICC 2010, San Jose, California, USA, 19-22 September, 2010, Proceedings. pages 1-4, IEEE, 2010. [doi]
Abstract is missing.