Tadao Nakamura, Y. Mizushima, H. Kitada, Y. S. Kim, N. Maeda, S. Kodama, R. Sugie, Hiroshi Hashimoto, A. Kawai, K. Arai, A. Uedono, T. Ohba. Influence of wafer thinning process on backside damage in 3D integration. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-6, IEEE, 2013. [doi]
@inproceedings{NakamuraMKKMKSHKAUO13,
title = {Influence of wafer thinning process on backside damage in 3D integration},
author = {Tadao Nakamura and Y. Mizushima and H. Kitada and Y. S. Kim and N. Maeda and S. Kodama and R. Sugie and Hiroshi Hashimoto and A. Kawai and K. Arai and A. Uedono and T. Ohba},
year = {2013},
doi = {10.1109/3DIC.2013.6702400},
url = {http://dx.doi.org/10.1109/3DIC.2013.6702400},
researchr = {https://researchr.org/publication/NakamuraMKKMKSHKAUO13},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013},
publisher = {IEEE},
}