Tadao Nakamura, Y. Mizushima, H. Kitada, Y. S. Kim, N. Maeda, S. Kodama, R. Sugie, Hiroshi Hashimoto, A. Kawai, K. Arai, A. Uedono, T. Ohba. Influence of wafer thinning process on backside damage in 3D integration. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-6, IEEE, 2013. [doi]
Abstract is missing.