Kosuke Nanbara, Akihiro Odoriba, Masaki Hashizume, Hiroyuki Yotsuyanagi, Shyue-Kung Lu. Electrical interconnect test of 3D ICs made of dies without ESD protection circuits with a built-in test circuit. In 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE, 2015. [doi]
Abstract is missing.