Ghanshyam Nayak, P. R. Mukund. Chip Package Co-Design of a Heterogeneously Integrated 2.45GHz CMOS VCO using Embedded Passives in a Silicon Package. In 17th International Conference on VLSI Design (VLSI Design 2004), with the 3rd International Conference on Embedded Systems Design, 5-9 January 2004, Mumbai, India. pages 627-630, IEEE Computer Society, 2004. [doi]
@inproceedings{NayakM04,
title = {Chip Package Co-Design of a Heterogeneously Integrated 2.45GHz CMOS VCO using Embedded Passives in a Silicon Package},
author = {Ghanshyam Nayak and P. R. Mukund},
year = {2004},
url = {http://csdl.computer.org/comp/proceedings/vlsid/2004/2072/00/20720627abs.htm},
tags = {design},
researchr = {https://researchr.org/publication/NayakM04},
cites = {0},
citedby = {0},
pages = {627-630},
booktitle = {17th International Conference on VLSI Design (VLSI Design 2004), with the 3rd International Conference on Embedded Systems Design, 5-9 January 2004, Mumbai, India},
publisher = {IEEE Computer Society},
isbn = {0-7695-2072-3},
}