C. Roda Neve, Mikael Detalle, P. Nolmans, Yunlong Li, Joeri De Vos, Geert Van der Plas, Gerald Beyer, Eric Beyne. High-density and low-leakage novel embedded 3D MIM capacitor on Si interposer. In 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016. pages 1-4, IEEE, 2016. [doi]
@inproceedings{NeveDNLVPBB16,
title = {High-density and low-leakage novel embedded 3D MIM capacitor on Si interposer},
author = {C. Roda Neve and Mikael Detalle and P. Nolmans and Yunlong Li and Joeri De Vos and Geert Van der Plas and Gerald Beyer and Eric Beyne},
year = {2016},
doi = {10.1109/3DIC.2016.7970024},
url = {https://doi.org/10.1109/3DIC.2016.7970024},
researchr = {https://researchr.org/publication/NeveDNLVPBB16},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016},
publisher = {IEEE},
isbn = {978-1-5090-1399-9},
}