C. Roda Neve, Mikael Detalle, P. Nolmans, Yunlong Li, Joeri De Vos, Geert Van der Plas, Gerald Beyer, Eric Beyne. High-density and low-leakage novel embedded 3D MIM capacitor on Si interposer. In 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016. pages 1-4, IEEE, 2016. [doi]
Abstract is missing.