H. V. Nguyen, Cora Salm, J. Vroemen, J. Voets, B. Krabbenborg, J. Bisschop, A. J. Mouthaan, Fred G. Kuper. Fast temperature cycling and electromigration induced thin film cracking in multilevel interconnection: experiments and modeling. Microelectronics Reliability, 42(9-11):1415-1420, 2002. [doi]
Abstract is missing.