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CC-RTSV: Cross-Cellular Based Redundant TSV Design for 3D ICs

Tianming Ni, Yue Shu, Hao Chang, Lin Lu, Guangzhen Dai, Shidong Zhu, Chengming Qu, Zhengfeng Huang. CC-RTSV: Cross-Cellular Based Redundant TSV Design for 3D ICs. Journal of Circuits, Systems, and Computers, 29(11), 2020. [doi]

Authors

Tianming Ni

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Yue Shu

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Hao Chang

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Lin Lu

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Guangzhen Dai

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Shidong Zhu

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Chengming Qu

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Zhengfeng Huang

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