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Tianming Ni, Yue Shu, Hao Chang, Lin Lu, Guangzhen Dai, Shidong Zhu, Chengming Qu, Zhengfeng Huang. CC-RTSV: Cross-Cellular Based Redundant TSV Design for 3D ICs. Journal of Circuits, Systems, and Computers, 29(11), 2020. [doi]
Abstract is missing.