Tianming Ni, Yue Shu, Hao Chang, Lin Lu, Guangzhen Dai, Shidong Zhu, Chengming Qu, Zhengfeng Huang. CC-RTSV: Cross-Cellular Based Redundant TSV Design for 3D ICs. Journal of Circuits, Systems, and Computers, 29(11), 2020. [doi]
@article{NiSCLDZQH20,
title = {CC-RTSV: Cross-Cellular Based Redundant TSV Design for 3D ICs},
author = {Tianming Ni and Yue Shu and Hao Chang and Lin Lu and Guangzhen Dai and Shidong Zhu and Chengming Qu and Zhengfeng Huang},
year = {2020},
doi = {10.1142/S0218126620501443},
url = {https://doi.org/10.1142/S0218126620501443},
researchr = {https://researchr.org/publication/NiSCLDZQH20},
cites = {0},
citedby = {0},
journal = {Journal of Circuits, Systems, and Computers},
volume = {29},
number = {11},
}