A Cost-Effective TSV Repair Architecture for Clustered Faults in 3-D IC

Tianming Ni, Qi Xu, Zhengfeng Huang, Huaguo Liang, Aibin Yan, Xiaoqing Wen. A Cost-Effective TSV Repair Architecture for Clustered Faults in 3-D IC. IEEE Trans. on CAD of Integrated Circuits and Systems, 40(9):1952-1956, 2021. [doi]

Abstract

Abstract is missing.