Low temperature direct bonding for hermetic wafer level packaging - researchr publication authors

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Lei Nie, Tielin Shi, Zirong Tang, Shiyuan Liu, Guanglan Liao. Low temperature direct bonding for hermetic wafer level packaging. In 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2009, Shenzhen, China, January 5-8, 2009. pages 472-475, IEEE, 2009. [doi]

This author has not been identified. Look up 'Lei Nie' in GoogleThis author has not been identified. Look up 'Tielin Shi' in GoogleThis author has not been identified. Look up 'Zirong Tang' in GoogleThis author has not been identified. Look up 'Shiyuan Liu' in GoogleThis author has not been identified. Look up 'Guanglan Liao' in Google

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