Lei Nie, Tielin Shi, Zirong Tang, Shiyuan Liu, Guanglan Liao. Low temperature direct bonding for hermetic wafer level packaging. In 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2009, Shenzhen, China, January 5-8, 2009. pages 472-475, IEEE, 2009. [doi]
Abstract is missing.