Arthur Nieuwoudt, Jamil Kawa, Yehia Massoud. Impact of dummy filling techniques on interconnect capacitance and planarization in nano-scale process technology. In Vijay Narayanan, Zhiyuan Yan, Enrico Macii, Sanjukta Bhanja, editors, Proceedings of the 18th ACM Great Lakes Symposium on VLSI 2008, Orlando, Florida, USA, May 4-6, 2008. pages 151-154, ACM, 2008. [doi]
Abstract is missing.