Material and device innovation impact on reliability for scaled CMOS technologies

Tanya Nigam, Andreas Kerber, T. Shen, R. Ranjan, L. Cao. Material and device innovation impact on reliability for scaled CMOS technologies. In 47th European Solid-State Device Research Conference, ESSDERC 2017, Leuven, Belgium, September 11-14, 2017. pages 134-139, IEEE, 2017. [doi]

Abstract

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