Dimin Niu, Shuangchen Li, Yuhao Wang, Wei Han, Zhe Zhang, Yijin Guan, Tianchan Guan, Fei Sun, Fei Xue, Lide Duan, Yuanwei Fang, Hongzhong Zheng, Xiping Jiang, Song Wang, Fengguo Zuo, Yubing Wang, Bing Yu, Qiwei Ren, Yuan Xie. 23D Logic-to-DRAM Hybrid Bonding with Process-Near-Memory Engine for Recommendation System. In IEEE International Solid-State Circuits Conference, ISSCC 2022, San Francisco, CA, USA, February 20-26, 2022. pages 1-3, IEEE, 2022. [doi]
@inproceedings{NiuLWHZGGSXDFZJ22,
title = {23D Logic-to-DRAM Hybrid Bonding with Process-Near-Memory Engine for Recommendation System},
author = {Dimin Niu and Shuangchen Li and Yuhao Wang and Wei Han and Zhe Zhang and Yijin Guan and Tianchan Guan and Fei Sun and Fei Xue and Lide Duan and Yuanwei Fang and Hongzhong Zheng and Xiping Jiang and Song Wang and Fengguo Zuo and Yubing Wang and Bing Yu and Qiwei Ren and Yuan Xie},
year = {2022},
doi = {10.1109/ISSCC42614.2022.9731694},
url = {https://doi.org/10.1109/ISSCC42614.2022.9731694},
researchr = {https://researchr.org/publication/NiuLWHZGGSXDFZJ22},
cites = {0},
citedby = {0},
pages = {1-3},
booktitle = {IEEE International Solid-State Circuits Conference, ISSCC 2022, San Francisco, CA, USA, February 20-26, 2022},
publisher = {IEEE},
isbn = {978-1-6654-2800-2},
}