Dimin Niu, Shuangchen Li, Yuhao Wang, Wei Han, Zhe Zhang, Yijin Guan, Tianchan Guan, Fei Sun, Fei Xue, Lide Duan, Yuanwei Fang, Hongzhong Zheng, Xiping Jiang, Song Wang, Fengguo Zuo, Yubing Wang, Bing Yu, Qiwei Ren, Yuan Xie. 23D Logic-to-DRAM Hybrid Bonding with Process-Near-Memory Engine for Recommendation System. In IEEE International Solid-State Circuits Conference, ISSCC 2022, San Francisco, CA, USA, February 20-26, 2022. pages 1-3, IEEE, 2022. [doi]
Abstract is missing.