Tomohiro Noguchi, Omran Hindawi, Mineo Kaneko. Three-Dimensional Flexible-Module Placement for Stacked Three-Dimensional Integration. In IEEE International Symposium on Circuits and Systems, ISCAS 2022, Austin, TX, USA, May 27 - June 1, 2022. pages 3260-3264, IEEE, 2022. [doi]
Abstract is missing.