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Pre-bond probing of TSVs in 3D stacked ICs

Brandon Noia, Krishnendu Chakrabarty. Pre-bond probing of TSVs in 3D stacked ICs. In Bill Eklow, R. D. (Shawn) Blanton, editors, 2011 IEEE International Test Conference, ITC 2011, Anaheim, CA, USA, September 20-22, 2011. pages 1-10, IEEE, 2011. [doi]

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