Brandon Noia, Sandeep Kumar Goel, Krishnendu Chakrabarty, Erik Jan Marinissen, Jouke Verbree. Test-architecture optimization for TSV-based 3D stacked ICs. In 15th European Test Symposium (ETS 2010), May 24-28, 2010, Prague, Czech Republic. pages 24-29, IEEE Computer Society, 2010. [doi]
Abstract is missing.