Osamu Nukaga, Tatsuya Shioiri, Satoshi Yamamoto, Tatsuo Suemasu. Glass interposer with high-density three-dimensional structured TGV for 3D system integration. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-4, IEEE, 2013. [doi]
Abstract is missing.