The effect of a post processing thermal anneal on pre-existing and stress induced electrically active defects in ultra-thin SiON dielectric layers

Robert O Connor, Greg Hughes. The effect of a post processing thermal anneal on pre-existing and stress induced electrically active defects in ultra-thin SiON dielectric layers. Microelectronics Reliability, 51(3):524-528, 2011. [doi]

Abstract

Abstract is missing.