2 - the Internet of Tiny Things: Realizing mm-Scale Sensors through 3D Die Stacking

Sechang Oh, Minchang Cho, Xiao Wu 0002, Yejoong Kim, Li-Xuan Chuo, Wootaek Lim, Pat Pannuto, Suyoung Bang, Kaiyuan Yang, Hun-Seok Kim, Dennis Sylvester, David T. Blaauw. 2 - the Internet of Tiny Things: Realizing mm-Scale Sensors through 3D Die Stacking. In Design, Automation & Test in Europe Conference & Exhibition, DATE 2019, Florence, Italy, March 25-29, 2019. pages 686-691, IEEE, 2019. [doi]

Abstract

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