Masaki Ohyama, Masatsugu Nimura, Jun Mizuno, Shuichi Shoji, Toshihisa Nonaka, Yoichi Shinba, Akitsu Shigetou. Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection. Microelectronics Reliability, 59:134-139, 2016. [doi]
@article{OhyamaNMSNSS16,
title = {Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection},
author = {Masaki Ohyama and Masatsugu Nimura and Jun Mizuno and Shuichi Shoji and Toshihisa Nonaka and Yoichi Shinba and Akitsu Shigetou},
year = {2016},
doi = {10.1016/j.microrel.2015.12.033},
url = {http://dx.doi.org/10.1016/j.microrel.2015.12.033},
researchr = {https://researchr.org/publication/OhyamaNMSNSS16},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {59},
pages = {134-139},
}