Allison T. Osmanson, M. Tajedini Y. R. Kim, Hossein Madanipour, C. Kim, B. Glasscock, M. Khan. Mechanisms of Contact Formation and Electromigration Reliability in Wirebond Packages. In IEEE International Reliability Physics Symposium, IRPS 2021, Monterey, CA, USA, March 21-25, 2021. pages 1-6, IEEE, 2021. [doi]
Abstract is missing.