Jiaojiao Ou, Xiaoqing Xu, Brian Cline, Greg Yeric, David Z. Pan. DTCO for DSA-MP Hybrid Lithography with Double-BCP Materials in Sub-7nm Node. In 2017 IEEE International Conference on Computer Design, ICCD 2017, Boston, MA, USA, November 5-8, 2017. pages 403-410, IEEE Computer Society, 2017. [doi]
@inproceedings{OuXCYP17,
title = {DTCO for DSA-MP Hybrid Lithography with Double-BCP Materials in Sub-7nm Node},
author = {Jiaojiao Ou and Xiaoqing Xu and Brian Cline and Greg Yeric and David Z. Pan},
year = {2017},
doi = {10.1109/ICCD.2017.70},
url = {http://doi.ieeecomputersociety.org/10.1109/ICCD.2017.70},
researchr = {https://researchr.org/publication/OuXCYP17},
cites = {0},
citedby = {0},
pages = {403-410},
booktitle = {2017 IEEE International Conference on Computer Design, ICCD 2017, Boston, MA, USA, November 5-8, 2017},
publisher = {IEEE Computer Society},
isbn = {978-1-5386-2254-4},
}