Evaluation of using inductive/capacitive-coupling vertical interconnects in 3D network-on-chip - researchr publication authors

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Jin Ouyang, Jing Xie, Matthew Poremba, Yuan Xie. Evaluation of using inductive/capacitive-coupling vertical interconnects in 3D network-on-chip. In 2010 International Conference on Computer-Aided Design (ICCAD 10), November 7-11, 2010, San Jose, CA, USA. pages 477-482, IEEE, 2010. [doi]

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