Jin Ouyang, Jing Xie, Matthew Poremba, Yuan Xie. Evaluation of using inductive/capacitive-coupling vertical interconnects in 3D network-on-chip. In 2010 International Conference on Computer-Aided Design (ICCAD 10), November 7-11, 2010, San Jose, CA, USA. pages 477-482, IEEE, 2010. [doi]
@inproceedings{OuyangXPX10,
title = {Evaluation of using inductive/capacitive-coupling vertical interconnects in 3D network-on-chip},
author = {Jin Ouyang and Jing Xie and Matthew Poremba and Yuan Xie},
year = {2010},
doi = {10.1109/ICCAD.2010.5653769},
url = {http://dx.doi.org/10.1109/ICCAD.2010.5653769},
researchr = {https://researchr.org/publication/OuyangXPX10},
cites = {0},
citedby = {0},
pages = {477-482},
booktitle = {2010 International Conference on Computer-Aided Design (ICCAD 10), November 7-11, 2010, San Jose, CA, USA},
publisher = {IEEE},
}