Excellent Reliability of Xtacking™ Bonding Interface

Yan Ouyang, Suhui Yang, Dandan Yin, Xiang Huang, Zhiqiang Wang, Shengwei Yang, Kun Han, Zhongyi Xia. Excellent Reliability of Xtacking™ Bonding Interface. In IEEE International Reliability Physics Symposium, IRPS 2021, Monterey, CA, USA, March 21-25, 2021. pages 1-6, IEEE, 2021. [doi]

Abstract

Abstract is missing.