Jiwoo Pak, Sung Kyu Lim, David Z. Pan. Electromigration-aware routing for 3D ICs with stress-aware EM modeling. In 2012 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2012, San Jose, CA, USA, November 5-8, 2012. pages 325-332, IEEE, 2012. [doi]
@inproceedings{PakLP12,
title = {Electromigration-aware routing for 3D ICs with stress-aware EM modeling},
author = {Jiwoo Pak and Sung Kyu Lim and David Z. Pan},
year = {2012},
url = {http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=6386630},
researchr = {https://researchr.org/publication/PakLP12},
cites = {0},
citedby = {0},
pages = {325-332},
booktitle = {2012 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2012, San Jose, CA, USA, November 5-8, 2012},
publisher = {IEEE},
}