Electromigration-aware routing for 3D ICs with stress-aware EM modeling

Jiwoo Pak, Sung Kyu Lim, David Z. Pan. Electromigration-aware routing for 3D ICs with stress-aware EM modeling. In 2012 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2012, San Jose, CA, USA, November 5-8, 2012. pages 325-332, IEEE, 2012. [doi]

Abstract

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