Electromigration study for multi-scale power/ground vias in TSV-based 3D ICs - researchr publication authors

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Jiwoo Pak, Sung Kyu Lim, David Z. Pan. Electromigration study for multi-scale power/ground vias in TSV-based 3D ICs. In Jörg Henkel, editor, The IEEE/ACM International Conference on Computer-Aided Design, ICCAD'13, San Jose, CA, USA, November 18-21, 2013. pages 379-386, IEEE/ACM, 2013. [doi]

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