Jiwoo Pak, Sung Kyu Lim, David Z. Pan. Electromigration study for multi-scale power/ground vias in TSV-based 3D ICs. In Jörg Henkel, editor, The IEEE/ACM International Conference on Computer-Aided Design, ICCAD'13, San Jose, CA, USA, November 18-21, 2013. pages 379-386, IEEE/ACM, 2013. [doi]
@inproceedings{PakLP13,
title = {Electromigration study for multi-scale power/ground vias in TSV-based 3D ICs},
author = {Jiwoo Pak and Sung Kyu Lim and David Z. Pan},
year = {2013},
url = {http://dl.acm.org/citation.cfm?id=2561904},
researchr = {https://researchr.org/publication/PakLP13},
cites = {0},
citedby = {0},
pages = {379-386},
booktitle = {The IEEE/ACM International Conference on Computer-Aided Design, ICCAD'13, San Jose, CA, USA, November 18-21, 2013},
editor = {Jörg Henkel},
publisher = {IEEE/ACM},
isbn = {978-1-4799-1069-4},
}