3D-IC dynamic thermal analysis with hierarchical and configurable chip thermal model - researchr publication authors

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Stephen H. Pan, Norman Chang, Tadaaki Hitomi. 3D-IC dynamic thermal analysis with hierarchical and configurable chip thermal model. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-8, IEEE, 2013. [doi]

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