Stephen H. Pan, Norman Chang, Tadaaki Hitomi. 3D-IC dynamic thermal analysis with hierarchical and configurable chip thermal model. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-8, IEEE, 2013. [doi]
@inproceedings{PanCH13,
title = {3D-IC dynamic thermal analysis with hierarchical and configurable chip thermal model},
author = {Stephen H. Pan and Norman Chang and Tadaaki Hitomi},
year = {2013},
doi = {10.1109/3DIC.2013.6702373},
url = {http://dx.doi.org/10.1109/3DIC.2013.6702373},
researchr = {https://researchr.org/publication/PanCH13},
cites = {0},
citedby = {0},
pages = {1-8},
booktitle = {2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013},
publisher = {IEEE},
}