Shailja Pandey, Sayam Sethi, Preeti Ranjan Panda. 3D-TemPo: Optimizing 3-D DRAM Performance Under Temperature and Power Constraints. IEEE Trans. on CAD of Integrated Circuits and Systems, 43(8):2263-2276, August 2024. [doi]
@article{PandeySP24-0,
title = {3D-TemPo: Optimizing 3-D DRAM Performance Under Temperature and Power Constraints},
author = {Shailja Pandey and Sayam Sethi and Preeti Ranjan Panda},
year = {2024},
month = {August},
doi = {10.1109/TCAD.2024.3367235},
url = {https://doi.org/10.1109/TCAD.2024.3367235},
researchr = {https://researchr.org/publication/PandeySP24-0},
cites = {0},
citedby = {0},
journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
volume = {43},
number = {8},
pages = {2263-2276},
}