Long term efficacy of ultra-thin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding

Asisa Kumar Panigrahi, Satish Bonam, Tamal Ghosh, Siva Rama Krishna Vanjari, Shiv Govind Singh. Long term efficacy of ultra-thin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding. In 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE, 2015. [doi]

Abstract

Abstract is missing.