3D NoCs with active interposer for multi-die systems

Vasil Pano, Ragh Kuttappa, Baris Taskin. 3D NoCs with active interposer for multi-die systems. In Paul Bogdan, Cristina Silvano, editors, Proceedings of the 13th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2019, New York, NY, USA, October 17-18, 2019. ACM, 2019. [doi]

Abstract

Abstract is missing.