Contactless inter-tier communication for heterogeneous 3-D ICs

Ioannis A. Papistas, Vasilis F. Pavlidis. Contactless inter-tier communication for heterogeneous 3-D ICs. In IEEE International Symposium on Circuits and Systems, ISCAS 2017, Baltimore, MD, USA, May 28-31, 2017. pages 1-4, IEEE, 2017. [doi]

Abstract

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