Die matching algorithm for enhancing parametric yield of 3D ICs

Sangdo Park, Taewhan Kim. Die matching algorithm for enhancing parametric yield of 3D ICs. In International SoC Design Conference, ISOCC 2012, Jeju Island, South Korea, November 4-7, 2012. pages 143-146, IEEE, 2012. [doi]

Abstract

Abstract is missing.